Desoldering apparatus and method
US4602733A · kind A · utility
11Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 11, 1985 |
| Grant date | Jul 29, 1986 |
| Priority date | — |
| Expiry date | Jan 11, 2005 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/018
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Apparatus for the selective removal of the solder and a connector soldered in the through hole of a circuit panel including means for heating the solder and a pair of aligned tubes placed against opposite surfaces of the panel surrounding the connecting through hole with the tubes being supplied with fluid under pressure so as to produce a pressure differential across the solder column in the through hole and effective to urge the connector and solder from the through hole into the low pressure tube when the solder is melted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.