John R. Slack
7Patents
7h-index
9Co-inventors
52Inventor score
Filing activity: Jan 11, 1985 → Nov 10, 1999
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5926369A | Vertically integrated multi-chip circuit package with heat-sink support | Electricity | 125 | Expired |
| US6061245A | Free standing, three dimensional, multi-chip, carrier package with air flow baffle | Electricity | 64 | Expired |
| US6037658A | Electronic package with heat transfer means | Electricity | 43 | Expired |
| US6075287A | Integrated, multi-chip, thermally conductive packaging device and methodology | Electricity | 41 | Expired |
| US5669775A | Assembly for mounting components to flexible cables | Electricity | 20 | Expired |
| US4602733A | Desoldering apparatus and method | Performing Operations; Transporting | 11 | Expired |
| US6256203A | Free standing, three dimensional, multi-chip, carrier package with air flow baffle | Electricity | 10 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.