Wafer chuck
US4603466A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 17, 1984 |
| Grant date | Aug 5, 1986 |
| Priority date | — |
| Expiry date | Feb 17, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/11
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The wafer chuck disclosed herein is adapted to hold a semiconductor wafer during high energy treatment in a vacuum environment. The wafer is clamped by its rim to a circular domed plate so as to distort the wafer into close proximity with the domed face of the plate. Ports are provided in the face of the plate for introducing a mobile gas under controlled pressure to the interstitial space between the wafer and the domed face of the plate. An annular groove is provided around the periphery of the domed face and this groove is connected to a vacuum pumping means thereby to minimize leakage of the mobile gas into the vacuum environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.