Wire bonding apparatus
US4603803A · kind A · utility
49Cited by
10References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 1985 |
| Grant date | Aug 5, 1986 |
| Priority date | — |
| Expiry date | Apr 2, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01082
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire-bonding apparatus which employs a belt-and-pulley driven, spring-returned Z-motion plate to appropriately locate a wire-axis-aligned, solenoid operated, wire feed-and-tear apparatus so that bonds can be quickly and effectively made upon devices located on an X-Y movement table.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.