Ceramic multilayer wiring board
US4604496A · kind A · utility
6Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 1984 |
| Grant date | Aug 5, 1986 |
| Priority date | — |
| Expiry date | Aug 14, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09845
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A ceramic multilayer wiring board is provided in which ceramic insulating layers and wiring patterns provided thereon are connected by conductors filling through-holes formed in the ceramic insulating layers. The through-holes are so formed that the superficial portions of each through-hole of the ceramic multilayer wiring board is smaller in diameter than the inside portion of the through-hole between the superficial portion. This can prevent the board from being cracked around the through-holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.