Tape packages
US4607276A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 8, 1984 |
| Grant date | Aug 19, 1986 |
| Priority date | — |
| Expiry date | Mar 8, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/24
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to Tape Packages adapted to house semiconductor devices. The packages comprise a base component having a cover component disposed thereon to form an enclosure to house the semiconductor. A tape lead frame is disposed between the base and the cover and has a plurality of lead fingers extending into the enclosure for electrical connection to the semiconductor component. A spring between the base and the semiconductor device presses the semiconductor device into contact with the cover component. The spring comprises at least one of the lead fingers which is bonded to the semiconductor device and formed into an arch-like shape which contacts the base component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.