Semiconductor chip with direct-bonded external leadframe
US4609936A · kind A · utility
4Cited by
19References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 1979 |
| Grant date | Sep 2, 1986 |
| Priority date | — |
| Expiry date | Sep 19, 1999 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Structure and process for providing a hard metallic leadframe directly bonded to a semiconductor chip without the necessity for solder or soft intermediate leadframes. The structure provides a strong bond at the semiconductor chip with the possibility for multiple simultaneous lead attachment of a leadframe having sufficient strength to serve as the external leads. The bonded structure may be conventionally encapsulated in a plastic or ceramic package, or may be glassed to provide a minimum volume hermetic chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.