Adhesion characterization test site
US4612805A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 24, 1984 |
| Grant date | Sep 23, 1986 |
| Priority date | — |
| Expiry date | Dec 24, 2004 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2203/0091
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test site for gauging the adhesion between the insulating layers and the metal layers used to produce the various devices on a semiconductor chip. The chip-sized test site can be formed along with the product chips on the product wafers. The layers of the test site are arranged such that a first polyimide layer forms a first test interface with a silicon nitride layer and a second test interface with a first metal layer, and a second polyimide layer forms a third test interface with a second metal layer, a fourth test interface with the first polyimide layer, and a fifth test interface with the silicon nitride layer. These five interfaces form a single continuous adhesion test interface. During a 90.degree. peel test, the layers of the test site will sequentially separate along this interface. Thus, the adhesion at five different interfaces can be tested during a single peel test on a chip-sized test site.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.