Mask assembly having mask stress relieving feature
US4615781A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 23, 1985 |
| Grant date | Oct 7, 1986 |
| Priority date | — |
| Expiry date | Oct 23, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/944
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a means of relieving stress on an apertured mask, typically used to deposit thin-film structures on a glass substrate, such that the mask easily conforms to the substrate surface when the mask is in its hold down and patterning position during the deposition process. In particular, the present invention provides a mask assembly having a structurally relieved inner apertured mask portion from an outer mask portion that serves to eliminate wrinkles or crimps in the mask during deposition which may produce unacceptable blurs or shorts between thin-film structures. The stress relieving feature includes a slot which is disposed peripherally about the inner mask and two small segments providing the interconnection between the inner and outer mask of the mask assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.