Robert A. Boudreau
18Patents
10h-index
14Co-inventors
69Inventor score
Filing activity: Jul 6, 1981 → Apr 15, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5026138A | Multi-fiber alignment package for tilted facet optoelectronic components | Physics | 56 | Expired |
| US4915057A | Apparatus and method for registration of shadow masked thin-film patterns | Electricity | 35 | Expired |
| US5011247A | Uptapered single-mode optical fiber package for optoelectronic components | Physics | 26 | Expired |
| US4615781A | Mask assembly having mask stress relieving feature | Emerging Cross-Sectional Technologies | 24 | Expired |
| US6023339A | One-dimensional active alignment of optical or opto-electronic devices on a substrate | Electricity | 18 | Expired |
| US4746548A | Method for registration of shadow masked thin-film patterns | Electricity | 17 | Expired |
| US5018820A | Method of optically coupling an uptapered single-mode optical fiber to optoelectronic components | Physics | 12 | Expired |
| US4715940A | Mask for patterning electrode structures in thin film EL devices | Electricity | 10 | Expired |
| US5024504A | Method of aligning and packaging an optoelectronic component with a single-mode optical fiber array | Physics | 10 | Expired |
| US4944569A | Multi-fiber alignment package for optoelectronic components | Emerging Cross-Sectional Technologies | 10 | Expired |
| US5224184A | Optical multi-chip interconnect | Physics | 9 | Expired |
| US5999269A | One-dimensional active alignment of optical or opto-electronic devices on a substrate | Electricity | 8 | Expired |
| US4957342A | Single-mode optical fiber array package for optoelectronic components | Physics | 6 | Expired |
| US4839563A | Pulse burst panel drive for electroluminescent displays | Physics | 6 | Expired |
| US6970628B2 | Active optical alignment and attachment thereto of a semiconductor optical component with an optical element formed on a planar lightwave circuit | Electricity | 5 | Expired |
| US5460318A | Diebonding geometry for packaging optoelectronics | Electricity | 4 | Expired |
| US6731853B2 | Multiple fiber chip clamp | Physics | 3 | Expired |
| US4388384A | Photoelectrochemical cell | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.