Encapsulation means and method for reducing flash
US4615857A · kind A · utility
38Cited by
16References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 30, 1984 |
| Grant date | Oct 7, 1986 |
| Priority date | — |
| Expiry date | Nov 30, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Injection or transfer molding of plastic is performed in a manner that virtually eliminates flash. Deflection of the mold press is measured with the mold press in a clamping configuration. Then the support structure of the molds is arranged to apply an equal force to the mold face by configuring supporting pillars and bars such that they act as individual springs. Their spring constants and/or lengths are calculated to account for the actual deflection found in the mold press, thereby, producing a uniform pressure on the molds during clamping of the press.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.