John Baird
21Patents
13h-index
7Co-inventors
74Inventor score
Filing activity: Nov 30, 1984 → Aug 1, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5397917A | Semiconductor package capable of spreading heat | Electricity | 152 | Expired |
| US5541450A | Low-profile ball-grid array semiconductor package | Emerging Cross-Sectional Technologies | 150 | Expired |
| US5639695A | Low-profile ball-grid array semiconductor package and method | Emerging Cross-Sectional Technologies | 81 | Expired |
| US4966566A | Raising and lowering aid for trolling motors | Performing Operations; Transporting | 49 | Expired |
| US5118271A | Apparatus for encapsulating a semiconductor device | Performing Operations; Transporting | 38 | Expired |
| US4615857A | Encapsulation means and method for reducing flash | Electricity | 38 | Expired |
| US5252783A | Semiconductor package | Electricity | 25 | Expired |
| US5059105A | Resilient mold assembly | Performing Operations; Transporting | 24 | Expired |
| US4634390A | Raising and lowering aid for trolling motors | Performing Operations; Transporting | 18 | Expired |
| US4910581A | Internally molded isolated package | Electricity | 17 | Expired |
| USD832539S1 | Dryer ball | General | 16 | Active |
| US4996170A | Molding process for encapsulating semiconductor devices using a thixotropic compound | Electricity | 15 | Expired |
| US4753160A | Mold press force equalizer | Performing Operations; Transporting | 13 | Expired |
| US5123826A | Molding pot having configured bottom | Emerging Cross-Sectional Technologies | 12 | Expired |
| US10465333B1 | Apparatus to prevent wadding of sheets in clothes dryer | Textiles; Paper | 10 | Active |
| US4741507A | Self-cleaning mold | Electricity | 10 | Expired |
| US5040965A | Molding handling aid | Emerging Cross-Sectional Technologies | 8 | Expired |
| US5378928A | Plastic encapsulated microelectronic device and method | Emerging Cross-Sectional Technologies | 5 | Expired |
| US5139728A | Method of using molding pot having configured bottom | Performing Operations; Transporting | 3 | Expired |
| US5523629A | Plastic encapsulated microelectronic device | Emerging Cross-Sectional Technologies | 3 | Expired |
| US5535510A | Plastic encapsulated microelectronic device and method | Emerging Cross-Sectional Technologies | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.