Sputtering system for cathode sputtering apparatus
US4619755A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 1985 |
| Grant date | Oct 28, 1986 |
| Priority date | — |
| Expiry date | Jul 25, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/34
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Sputtering system for cathode sputtering apparatus, having a cathode base body with a target of the material to be sputtered. In the marginal part of the target an anode is disposed which is provided with at least one groove. For the solution of the problem of obtaining stable operating conditions in the lengthy coating of substrates with insulating materials and of drawing a high portion of the cathode current to the anode for a long period of time, the at least one groove opens, in accordance with the invention, on a side of the anode that is not in line of sight with the target.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.