Palladium plating
US4622110A · kind A · utility
3Cited by
13References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 1985 |
| Grant date | Nov 11, 1986 |
| Priority date | — |
| Expiry date | Apr 17, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/627
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating bath composition is disclosed which permits high speed palladium deposition. The bath comprises carbonate or phosphate anion in a critical amount and is otherwise additive free. A pH of 7-9 is used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.