Semiconductor device
US4624137A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 1985 |
| Grant date | Nov 25, 1986 |
| Priority date | — |
| Expiry date | Oct 1, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N19/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor device comprising a semiconductor body having a depression formed into the first surface of the body. The device further comprises a member comprising a thermal-to-electric transducer or static electric element or electrical-to-thermal element, the member having a predetermined configuration suspended over the depression. The member is connected to the first surface at least at one location, the depression opening to the first surface around at least a portion of the predetermined configuration. The depression provides substantial physical and thermal isolation between the element and the semiconductor body. In this manner, an integrated semiconductor device provides an environment of substantial physical and thermal isolation between the transducer or element and the semiconductor body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.