Automatic assembly of integrated circuits
US4627151A · kind A · utility
58Cited by
16References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 1984 |
| Grant date | Dec 9, 1986 |
| Priority date | — |
| Expiry date | Mar 22, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49128
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for the assembly and packaging of integrated circuits employs circuit dice that have contact pads in a standard array; a leadframe having leads configured to have the same spring constant; a method for removing selected dice from a wafer array under computer control; and a method of simultaneously bonding all leads to the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.