Robert H. Bond
33Patents
13h-index
23Co-inventors
81Inventor score
Filing activity: Apr 14, 1976 → Aug 6, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5642261A | Ball-grid-array integrated circuit package with solder-connected thermal conductor | Emerging Cross-Sectional Technologies | 178 | Expired |
| US5991156A | Ball grid array integrated circuit package with high thermal conductivity | Emerging Cross-Sectional Technologies | 62 | Expired |
| US4627151A | Automatic assembly of integrated circuits | Emerging Cross-Sectional Technologies | 58 | Expired |
| US4722060A | Integrated-circuit leadframe adapted for a simultaneous bonding operation | Emerging Cross-Sectional Technologies | 54 | Expired |
| US4915565A | Manipulation and handling of integrated circuit dice | Emerging Cross-Sectional Technologies | 53 | Expired |
| US5642265A | Ball grid array package with detachable module | Emerging Cross-Sectional Technologies | 33 | Expired |
| US5693572A | Ball grid array integrated circuit package with high thermal conductivity | Emerging Cross-Sectional Technologies | 21 | Expired |
| US4759675A | Chip selection in automatic assembly of integrated circuit | Emerging Cross-Sectional Technologies | 20 | Expired |
| US5994774A | Surface mountable integrated circuit package with detachable module and interposer | Electricity | 19 | Expired |
| US6889813B1 | Material transport method | Emerging Cross-Sectional Technologies | 18 | Expired |
| US5724728A | Method of mounting an integrated circuit to a mounting surface | Emerging Cross-Sectional Technologies | 17 | Expired |
| US5111935A | Universal leadframe carrier | Electricity | 17 | Expired |
| US4743956A | Offset bending of curvaceously planar radiating leadframe leads in semiconductor chip packaging | Emerging Cross-Sectional Technologies | 13 | Expired |
| US4087308A | Apparatus and method for making reinforced elastomeric fabric | Emerging Cross-Sectional Technologies | 13 | Expired |
| US4860816A | Control system for vibratory apparatus | Performing Operations; Transporting | 13 | Expired |
| US8378508B2 | Integrally molded die and bezel structure for fingerprint sensors and the like | Electricity | 12 | Active |
| US4627787A | Chip selection in automatic assembly of integrated circuit | Emerging Cross-Sectional Technologies | 11 | Expired |
| USD652333S1 | Molded fingerprint sensor structure | General | 11 | Expired |
| USD652332S1 | Molded fingerprint sensor structure with indicia regions | General | 10 | Expired |
| US4626167A | Manipulation and handling of integrated circuit dice | Electricity | 10 | Expired |
| US8803258B2 | Finger sensor including capacitive lens and associated methods | Electricity | 8 | Active |
| US4685504A | Foundry sand feeding apparatus | Performing Operations; Transporting | 8 | Expired |
| US8569875B2 | Integrally molded die and bezel structure for fingerprint sensors and the like | Electricity | 8 | Active |
| US8471345B2 | Biometric sensor assembly with integrated visual indicator | Electricity | 6 | Active |
| US5182851A | Method for holding a strip of conductive lead frames | Emerging Cross-Sectional Technologies | 6 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.