Chip selection in automatic assembly of integrated circuit
US4627787A · kind A · utility
11Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 1984 |
| Grant date | Dec 9, 1986 |
| Priority date | — |
| Expiry date | Mar 22, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/19
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for removing selected integrated circuit dice from a wafer array of dice sequentially moves a striker above a tape to the underside of which the array is mounted and the knocks a die down from the array of dice into a receptacle for transport to further processing stages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.