Packaged semiconductor device structure including getter material for decreasing gas from a protective organic covering
US4630095A · kind A · utility
43Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 1984 |
| Grant date | Dec 16, 1986 |
| Priority date | — |
| Expiry date | Jun 29, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged semiconductor device structure includes a semiconductor chip with an organic material covering thereon. The semiconductor chip is placed in a package and hermetically sealed with a low melting point glass. The organic covering serve to suppress undesirable influence on the semiconductor chip by .alpha.-rays which may be radiated from the package, and a getter material is placed in the package for decreasing undesirable gases in the package which may be emitted by the organic covering during the sealing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.