Reduction atmosphere workpiece joining
US4632295A · kind A · utility
7Cited by
22References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 12, 1985 |
| Grant date | Dec 30, 1986 |
| Priority date | — |
| Expiry date | Aug 12, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3489
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A workpiece is joined to a substrate by employing solder and applying diol and/or polyol and/or ether derivative thereof to the substrate. The workpiece is placed in contact with the diol and/or polyol and the resulting assembly is heated in a reducing atmosphere.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.