Vlasta Brusic
31Patents
14h-index
50Co-inventors
84Inventor score
Filing activity: Apr 30, 1974 → Mar 18, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5755859A | Cobalt-tin alloys and their applications for devices, chip interconnections and packaging | Electricity | 315 | Expired |
| US4789914A | Thin film magnetic read-write head/arm assemblies | Physics | 100 | Expired |
| US7998335B2 | Controlled electrochemical polishing method | Electricity | 66 | Active |
| US6527622B1 | CMP method for noble metals | Electricity | 48 | Expired |
| US6632377B1 | Chemical-mechanical planarization of metallurgy | Electricity | 47 | Expired |
| US9343330B2 | Compositions for polishing aluminum/copper and titanium in damascene structures | Chemistry; Metallurgy | 34 | Active |
| US8435421B2 | Metal-passivating CMP compositions and methods | Electricity | 34 | Active |
| US5700398A | Composition containing a polymer and conductive filler and use thereof | Emerging Cross-Sectional Technologies | 30 | Expired |
| US5922466A | Composite comprising a metal substrate and a corrosion protecting layer | Emerging Cross-Sectional Technologies | 25 | Expired |
| US5997773A | Method for providing discharge protection or shielding | Emerging Cross-Sectional Technologies | 18 | Expired |
| US5316573A | Corrosion inhibition with CU-BTA | Chemistry; Metallurgy | 18 | Expired |
| US7265055B2 | CMP of copper/ruthenium substrates | Chemistry; Metallurgy | 18 | Expired |
| US5776587A | Electronic package comprising a substrate and a semiconductor device bonded thereto | Emerging Cross-Sectional Technologies | 17 | Expired |
| US5985458A | Housing for electromagnetic interference shielding | Emerging Cross-Sectional Technologies | 17 | Expired |
| US5916486A | Method for providing discharge protection or shielding | Emerging Cross-Sectional Technologies | 13 | Expired |
| US7097541B2 | CMP method for noble metals | Electricity | 13 | Expired |
| US6015509A | Composition containing a polymer and conductive filler and use thereof | Emerging Cross-Sectional Technologies | 10 | Expired |
| US6174606A | Corrosion and dissolution protection of a conductive silver/polymer composite | Emerging Cross-Sectional Technologies | 10 | Expired |
| US8101093B2 | Chemical-mechanical polishing composition and method for using the same | Chemistry; Metallurgy | 10 | Active |
| US8062096B2 | Use of CMP for aluminum mirror and solar cell fabrication | Electricity | 10 | Active |
| US7004819B2 | CMP systems and methods utilizing amine-containing polymers | Chemistry; Metallurgy | 9 | Expired |
| US7161247B2 | Polishing composition for noble metals | Electricity | 8 | Expired |
| US4632295A | Reduction atmosphere workpiece joining | Electricity | 7 | Expired |
| US7288021B2 | Chemical-mechanical polishing of metals in an oxidized form | Electricity | 6 | Expired |
| US7160807B2 | CMP of noble metals | Electricity | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.