Elastic bladder method of fabricating an integrated circuit package having bonding pads in a stepped cavity
US4636275A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 21, 1986 |
| Grant date | Jan 13, 1987 |
| Priority date | — |
| Expiry date | Jan 21, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package is fabricated by assembling a stack which is comprised of a plurality of thin flat epoxy-glass layers, adhesive layers between the epoxy-glass layers, and a staircase-shaped cavity. This cavity extends from an outer epoxy-glass layer to an internal epoxy-glass layer, goes parallel along a portion of the flat surface of the internal epoxy-glass layer, and then penetrates through it. Conductors lie on the internal epoxy-glass layer including bonding pads on the flat surface portion. After the stack is assembled, the outer epoxy-glass layer and the cavity are covered with an elastic bladder. Subsequently, the stack is laminated by forcing a fluid into the bladder at a temperature and pressure which causes the bladder's membrane to stretch and push against all the surfaces of the cavity. This dams the adhesive from flowing onto the bonding pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.