Inspection method and apparatus for joint junction states
US4641527A · kind A · utility
20Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 1, 1985 |
| Grant date | Feb 10, 1987 |
| Priority date | — |
| Expiry date | Mar 1, 2005 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/479
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An object to be inspected which is jointed to a circuit board is vibrated in a contactless manner by applying a gas jet or a magnetic force to the object, a laser beam is irradiated on the object, and a laser beam reflected from the object is detected by a linear sensor to observe a laser speckle pattern for the object. Quality of a joint junction state of the object is judged from the laser speckle pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.