Composite and circuit board having conductive layer on resin layer and method of manufacturing
US4643798A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 1985 |
| Grant date | Feb 17, 1987 |
| Priority date | — |
| Expiry date | Apr 9, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In manufacturing a composite having a conductive layer on the surface of a resin layer, first the resin layer of a mixture of a resin material and filler elements is formed on a substrate and the resin material of the surface of the resin layer is selectively etched with respect to the filler elements to expose a portion of the filler elements, and then the filler elements, as exposed on the selectively etched surface of the resin layer, are selectively etched with respect to the resin material to form unevenness. Then catalyst nuclei are formed for electroless plating on the selectively etched surface having the unevenness and then a conductive metallic layer is formed by an electroless plating process on the selectively etched surface having unevenness. As a result, a composite of the above described structure is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.