Hayato Takasago
26Patents
14h-index
25Co-inventors
77Inventor score
Filing activity: Aug 1, 1984 → Sep 7, 1995
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5113274A | Matrix-type color liquid crystal display device | Physics | 135 | Expired |
| US4993148A | Method of manufacturing a circuit board | Emerging Cross-Sectional Technologies | 90 | Expired |
| US4942140A | Method of packaging semiconductor device | Emerging Cross-Sectional Technologies | 84 | Expired |
| US6104464A | Rigid circuit board for liquid crystal display including cut out for providing flexibility to said board | Electricity | 68 | Expired |
| US4914815A | Method for manufacturing hybrid integrated circuits | Emerging Cross-Sectional Technologies | 68 | Expired |
| US4967261A | Tape carrier for assembling an IC chip on a substrate | Emerging Cross-Sectional Technologies | 67 | Expired |
| US5029984A | Liquid crystal display device | Electricity | 50 | Expired |
| US5173844A | Integrated circuit device having a metal substrate | Emerging Cross-Sectional Technologies | 48 | Expired |
| US5293262A | Liquid crystal display device having heat-insulating members and driving circuit boards attached to rear edges of light box | Electricity | 38 | Expired |
| US5081562A | Circuit board with high heat dissipations characteristic | Emerging Cross-Sectional Technologies | 33 | Expired |
| US5604513A | Serial sampling video signal driving apparatus with improved color rendition | Physics | 29 | Expired |
| US4629681A | Method of manufacturing multilayer circuit board | Electricity | 22 | Expired |
| US4943768A | Testing device for electrical circuit boards | Physics | 21 | Expired |
| US5269868A | Method for separating bonded substrates, in particular disassembling a liquid crystal display device | Emerging Cross-Sectional Technologies | 17 | Expired |
| US4854230A | Screen printing apparatus | Electricity | 14 | Expired |
| US4643798A | Composite and circuit board having conductive layer on resin layer and method of manufacturing | Electricity | 13 | Expired |
| US4685203A | Hybrid integrated circuit substrate and method of manufacturing the same | Emerging Cross-Sectional Technologies | 13 | Expired |
| US4783642A | Hybrid integrated circuit substrate and method of manufacturing the same | Emerging Cross-Sectional Technologies | 8 | Expired |
| US4645734A | Composite having conductive layer on resin layer and method of manufacturing | Electricity | 8 | Expired |
| US4963389A | Method for producing hybrid integrated circuit substrate | Electricity | 6 | Expired |
| US5034569A | Multilayer interconnection circuit board | Electricity | 6 | Expired |
| US4946709A | Method for fabricating hybrid integrated circuit | Emerging Cross-Sectional Technologies | 5 | Expired |
| US4898805A | Method for fabricating hybrid integrated circuit | Electricity | 4 | Expired |
| US4785157A | Method for controlling electric resistance of a compound-type resistors | Emerging Cross-Sectional Technologies | 3 | Expired |
| US5069745A | Process for preparing a combined wiring substrate | Electricity | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.