Epoxy-glass integrated circuit package having bonding pads in a stepped cavity
US4643935A · kind A · utility
32Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 21, 1986 |
| Grant date | Feb 17, 1987 |
| Priority date | — |
| Expiry date | Jan 21, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31525
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package comprises a plurality of thin flat epoxy-glass layers which are arranged in a stack and are laminated together by prepreg layers that lie between the epoxy-glass layers. This stack has a cavity which is staircase-shaped and extends from an outer epoxy-glass layer to an internal epoxy-glass layer, goes parallel along the internal epoxy-glass layer and then penetrates through it. Patterned electrical conductors lie on the flat surface of the internal epoxy-glass layer, including wire bonding pads on its exposed flat surface portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.