Composite having conductive layer on resin layer and method of manufacturing
US4645734A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 23, 1985 |
| Grant date | Feb 24, 1987 |
| Priority date | — |
| Expiry date | Apr 23, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/181
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In manufacturing a composite having a conductive layer on the surface of a resin layer, the first resin layer of polyimide is formed on a substrate of alumina ceramic and, after a resin layer is thermally set by heating, a second resin layer of polyimide is then formed on the first resin layer and is dried. Then the surface of the second resin layer is subjected to selective photoetching by using a photomask having predetermined small opaque areas distributed, thereby to form unevenness including concaves formed as a result of the selective photoetching. The layered composite thus obtained is then heated so that the second resin layer is thermally set. Then catalyst nuclei are formed for electroless plating on the etched surface having the unevenness formed and then a conductive metallic layer is formed by an electroless plating process on the etched surface having the unevenness formed. As a result, a composite of the above described structure is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.