Heat-conducting cooling module
US4649990A · kind A · utility
45Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 1985 |
| Grant date | Mar 17, 1987 |
| Priority date | — |
| Expiry date | May 6, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat-conducting cooling module for cooling a semiconductor substrate in an integrated circuit package assembly in which a semiconductor substrate is mounted on a base board by small solder pellets, and which contains a single substrate or laminated substrates. A heat-conducting relay member is provided between the semiconductor substrate and a housing so as to be pressed onto the semiconductor substrate. At least either one of the housing or the heat-conducting relay member is made of a sintered product which includes silicon carbide as a chief component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.