Tasao Soga
34Patents
16h-index
68Co-inventors
84Inventor score
Filing activity: Oct 28, 1981 → Jun 21, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4825284A | Semiconductor resin package structure | Electricity | 122 | Expired |
| US4970575A | Semiconductor device | Electricity | 83 | Expired |
| US6563225B2 | Product using Zn-Al alloy solder | Electricity | 78 | Expired |
| US5867809A | Electric appliance, printed circuit board, remained life estimation method, and system thereof | Emerging Cross-Sectional Technologies | 67 | Expired |
| US4906823A | Solder carrier, manufacturing method thereof and method of mounting semiconductor devices by utilizing same | Emerging Cross-Sectional Technologies | 56 | Expired |
| US4970577A | Semiconductor chip module | Electricity | 55 | Expired |
| US4649990A | Heat-conducting cooling module | Electricity | 45 | Expired |
| US4821142A | Ceramic multilayer circuit board and semiconductor module | Emerging Cross-Sectional Technologies | 45 | Expired |
| US7145236B2 | Semiconductor device having solder bumps reliably reflow solderable | Emerging Cross-Sectional Technologies | 42 | Expired |
| US6872465B2 | Solder | Emerging Cross-Sectional Technologies | 26 | Expired |
| US5942185A | Lead-free solder used for connecting electronic parts on organic substrate and electronic products made using same | Emerging Cross-Sectional Technologies | 23 | Expired |
| US7547966B2 | Power semiconductor module | Electricity | 23 | Active |
| US4908695A | Cooling apparatus and semiconductor device employing the same | Electricity | 21 | Expired |
| US6486411B2 | Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrate | Emerging Cross-Sectional Technologies | 21 | Expired |
| US4562637A | Method of manufacturing solar battery | Emerging Cross-Sectional Technologies | 20 | Expired |
| US6555052B2 | Electron device and semiconductor device | Emerging Cross-Sectional Technologies | 18 | Expired |
| US6204490A | Method and apparatus of manufacturing an electronic circuit board | Electricity | 15 | Expired |
| US7671465B2 | Power semiconductor module | Electricity | 12 | Active |
| US8022551B2 | Solder composition for electronic devices | Emerging Cross-Sectional Technologies | 11 | Active |
| US6774490B2 | Electronic device | Emerging Cross-Sectional Technologies | 9 | Expired |
| US4516149A | Semiconductor device having ribbon electrode structure and method for fabricating the same | Electricity | 9 | Expired |
| US7075183B2 | Electronic device | Emerging Cross-Sectional Technologies | 9 | Expired |
| US7013564B2 | Method of producing an electronic device having a PB free solder connection | Emerging Cross-Sectional Technologies | 8 | Expired |
| US7259465B2 | Semiconductor device with lead-free solder | Emerging Cross-Sectional Technologies | 7 | Expired |
| US4503597A | Method of forming a number of solder layers on a semiconductor wafer | Electricity | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.