Electroless copper plating bath and improved stability
US4655833A · kind A · utility
5Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 1985 |
| Grant date | Apr 7, 1987 |
| Priority date | — |
| Expiry date | Oct 9, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/40
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroless copper plating bath having improved stability which contains a cationic polymer from acrylamide and/or methacrylamide. The plating bath also contains a cupric ion source, a reducing agent for the cupric ion source, and a complexing agent for the cupric ion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.