Low cost integrated circuit bonding process
US4661192A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 22, 1985 |
| Grant date | Apr 28, 1987 |
| Priority date | — |
| Expiry date | Aug 22, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A low cost process for bonding a plurality of integrated circuit die to a variety of die support frames using existing, readily available equipment. Tape automatic bonding (TAB) processes offer a number of new possibilities in the assembly and packaging of integrated circuits. However, the investigation of TAB techniques or the use of TAB techniques on low volume parts is prohibited by the high cost of "bumping" or putting interconnection balls on the chip or the tape leads. The process permits placing balls on the bonding pads of a plurality of die by a wire bonder, cutting off the wire, planarizing the balls, coating the planarized region with a conductive epoxy and then registering and bonding the die to corresponding conductive patterns on die support frames.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.