Michael B. McShane
56Patents
27h-index
26Co-inventors
88Inventor score
Filing activity: Aug 22, 1985 → Apr 3, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5216278A | Semiconductor device having a pad array carrier package | Electricity | 625 | Expired |
| US5200362A | Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film | Emerging Cross-Sectional Technologies | 368 | Expired |
| US5157480A | Semiconductor device having dual electrical contact sites | Emerging Cross-Sectional Technologies | 343 | Expired |
| US5239198A | Overmolded semiconductor device having solder ball and edge lead connective structure | Emerging Cross-Sectional Technologies | 336 | Expired |
| US5273938A | Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer film | Emerging Cross-Sectional Technologies | 333 | Expired |
| US5041902A | Molded electronic package with compression structures | Electricity | 315 | Expired |
| US7777330B2 | High bandwidth cache-to-processing unit communication in a multiple processor/cache system | Electricity | 263 | Active |
| US5468999A | Liquid encapsulated ball grid array semiconductor device with fine pitch wire bonding | Electricity | 239 | Expired |
| US5450283A | Thermally enhanced semiconductor device having exposed backside and method for making the same | Electricity | 236 | Expired |
| US5247423A | Stacking three dimensional leadless multi-chip module and method for making the same | Electricity | 206 | Expired |
| US5517056A | Molded carrier ring leadframe having a particular resin injecting area design for gate removal and semiconductor device employing the same | Electricity | 199 | Expired |
| US4661192A | Low cost integrated circuit bonding process | Emerging Cross-Sectional Technologies | 154 | Expired |
| US5012386A | High performance overmolded electronic package | Electricity | 145 | Expired |
| US5105259A | Thermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipation | Electricity | 121 | Expired |
| US5311057A | Lead-on-chip semiconductor device and method for making the same | Electricity | 76 | Expired |
| US5147821A | Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation | Electricity | 63 | Expired |
| US5006922A | Packaged semiconductor device having a low cost ceramic PGA package | Electricity | 57 | Expired |
| US5018005A | Thin, molded, surface mount electronic device | Emerging Cross-Sectional Technologies | 49 | Expired |
| US5455200A | Method for making a lead-on-chip semiconductor device having peripheral bond pads | Emerging Cross-Sectional Technologies | 46 | Expired |
| US4837184A | Process of making an electronic device package with peripheral carrier structure of low-cost plastic | Emerging Cross-Sectional Technologies | 42 | Expired |
| US5053357A | Method of aligning and mounting an electronic device on a printed circuit board using a flexible substrate having fixed lead arrays thereon | Emerging Cross-Sectional Technologies | 40 | Expired |
| US5220195A | Semiconductor device having a multilayer leadframe with full power and ground planes | Electricity | 38 | Expired |
| US5381036A | Lead-on chip semiconductor device having peripheral bond pads | Emerging Cross-Sectional Technologies | 36 | Expired |
| US5029325A | TAB tape translator for use with semiconductor devices | Electricity | 36 | Expired |
| US5045914A | Plastic pad array electronic AC device | Emerging Cross-Sectional Technologies | 36 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.