Resin-sealed radiation shield for a semiconductor device
US4661837A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 12, 1985 |
| Grant date | Apr 28, 1987 |
| Priority date | — |
| Expiry date | Dec 12, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resin-sealed type semiconductor device includes a semiconductor chip and a radiation shield film disposed in close contact with the surface of the chip. Internal leads are bonded to the electrodes on the chip and external leads are bonded to the internal leads. A sealing resin is molded around the chip, the radiation shield film, and the internal leads. A method for manufacturing the semiconductor device mentioned above includes the steps of mounting a semiconductor chip onto a film carrier, with the surface of the chip are in close contact with the radiation shield film of the film carrier. The electrodes on the chip are bonded to the internal leads supported by the film carrier separating the internal leads and the radiation shield film from the frame of the film carrier, thereby forming an intermediate assembly comprising the chip, the radiation shield film, and the internal leads. The intermediate assembly is mounted onto a lead frame, with the internal leads being bonded to the external leads of the lead frame and molding a sealing resin around the chip, the radiation shield film, and the internal fields, and separating the external leads from the frame portion of the lead f…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.