Michio Sono
28Patents
18h-index
44Co-inventors
77Inventor score
Filing activity: Dec 12, 1985 → Dec 28, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5643831A | Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device | Electricity | 200 | Expired |
| US5801439A | Semiconductor device and semiconductor device unit for a stack arrangement | Electricity | 122 | Expired |
| US5451815A | Semiconductor device with surface mount package adapted for vertical mounting | Emerging Cross-Sectional Technologies | 100 | Expired |
| US5920117A | Semiconductor device and method of forming the device | Electricity | 77 | Expired |
| US5521432A | Semiconductor device having improved leads comprising palladium plated nickel | Emerging Cross-Sectional Technologies | 53 | Expired |
| US6025258A | Method for fabricating solder bumps by forming solder balls with a solder ball forming member | Electricity | 52 | Expired |
| US5760471A | Semiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic package | Electricity | 50 | Expired |
| US4788583A | Semiconductor device and method of producing semiconductor device | Electricity | 48 | Expired |
| US4661837A | Resin-sealed radiation shield for a semiconductor device | Electricity | 46 | Expired |
| US5497032A | Semiconductor device and lead frame therefore | Electricity | 45 | Expired |
| US5804468A | Process for manufacturing a packaged semiconductor having a divided leadframe stage | Electricity | 36 | Expired |
| US5703398A | Semiconductor integrated circuit device and method of producing the semiconductor integrated circuit device | Electricity | 29 | Expired |
| US5444025A | Process for encapsulating a semiconductor package having a heat sink using a jig | Emerging Cross-Sectional Technologies | 28 | Expired |
| US5786985A | Semiconductor device and semiconductor device unit | Emerging Cross-Sectional Technologies | 25 | Expired |
| US5305179A | Surface-mounting type semiconductor package having an improved efficiency for heat dissipation | Emerging Cross-Sectional Technologies | 24 | Expired |
| US5424251A | Method of producing semiconductor device having radiation part made of resin containing insulator powders | Emerging Cross-Sectional Technologies | 24 | Expired |
| US5747874A | Semiconductor device, base member for semiconductor device and semiconductor device unit | Electricity | 22 | Expired |
| US6022759A | Method for producing a semiconductor device, base member for semiconductor device and semiconductor device unit | Electricity | 21 | Expired |
| US5684675A | Semiconductor device unit having holder | Emerging Cross-Sectional Technologies | 18 | Expired |
| US5574310A | Semiconductor package for surface mounting with reinforcing members on support legs | Emerging Cross-Sectional Technologies | 16 | Expired |
| US5296740A | Method and apparatus for a semiconductor device having a radiation part | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6528346B2 | Bump-forming method using two plates and electronic device | Electricity | 12 | Expired |
| US5309016A | Semiconductor integrated circuit device having terminal members provided between semiconductor element and leads | Electricity | 8 | Expired |
| US5659200A | Semiconductor device having radiator structure | Emerging Cross-Sectional Technologies | 7 | Expired |
| US5861669A | Semiconductor package for surface mounting | Emerging Cross-Sectional Technologies | 6 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.