Method of double floating transport and processing of wafers within a confined passageway
US4662987A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 25, 1986 |
| Grant date | May 5, 1987 |
| Priority date | — |
| Expiry date | Mar 25, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67784
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Method of transporting and processing of substrates, including wafers of the type used for semiconductors. Particularly, a method of flowing fluid medium longitudinally within a confined passageway so that the substrate is supported, transported and processed in a double floating condition without touching the walls of the passageway. The method is characterized by the restricting of flowing of fluid medium into the passageway, so as to guide the substrate during transport and processing by injecting pressurized coating medium into the passageway at a series of processing stations defined intermediate transport sections of said passageway.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.