High-strength, high-conductivity copper alloy
US4666667A · kind A · utility
22Cited by
1References
6Claims
0Family size
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Key dates
| Filing date | Mar 25, 1986 |
| Grant date | May 19, 1987 |
| Priority date | — |
| Expiry date | Mar 25, 2006 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22F1/08
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A high-strength, high-conductivity copper alloy comprises, all by weight, from 0.8 to 4.0% of Sn, from more than 0.01 to 0.4% of P, from 0.05 to 1.0% of Ni, from 0.05 to 1.0% of one, two or more elements selected from Al, Hf, Be, Mo, Zn, Te, Pb, Co, Zr, and Nb, and the remainder of Cu and inevitable impurities. The impurities include not more than 0.0020% of oxygen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.