Sputter module for modular wafer processing system
US4670126A · kind A · utility
414Cited by
6References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 1986 |
| Grant date | Jun 2, 1987 |
| Priority date | — |
| Expiry date | Apr 28, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A machine for sputter deposition of a wafer workpiece also sputters on the wafer supporting mechanism. This causes a need for cleaning or replacement of the support mechanism. A sputter machine is provided in which the supporting mechanism can be isolated from the sputtering source, the pumps and other processing apparatus for cleaning without exposing the entire machine to atmosphere.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.