Method for preparing aluminum for plating
US4670312A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 7, 1985 |
| Grant date | Jun 2, 1987 |
| Priority date | — |
| Expiry date | Feb 7, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/44
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Method for preparing aluminum, especially large aluminum pieces or articles having a surface layer of aluminum oxide for subsequent metal plating wherein the aluminum or aluminum alloy substrate is immersed in a bath containing metal salts and acid such that the acid content relative to the metal salt is sufficient to remove the surface aluminum oxide layer without substantial attack on the underlying aluminum while enabling the permanent deposit thereon of a continuous, smooth, adherent metal or metal alloy coating directly onto the aluminum, thereby replacing the aluminum oxide layer. Subsequent, essentially blister-free electroless or electrolytic plating of nickel or a nickel alloy, copper or a copper alloy onto the metal or metal alloy coated aluminum are made possible thereby.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.