Structure containing a layer consisting of a polyimide and an organic filled and method for producing such a structure
US4670325A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 1986 |
| Grant date | Jun 2, 1987 |
| Priority date | — |
| Expiry date | Jul 2, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A structure comprising on a substrate successive layers of metal circuitry having therebetween as a dielectric a cured polyimide composition containing a polyimide and aluminum oxide or zinc oxide or mixtures thereof. The structure is produced by a method including the following process steps: PA1 blanket screen printing a mixture containing a polyamido carboxylic acid, aluminum oxide or zinc oxide or mixtures thereof and a detackifier with the rest being a solvent on a substrate with a layer of metal circuitry thereon, PA1 drying the deposited layer at a temperature between about 25.degree. and about 120.degree. C., PA1 selectively etching holes into the deposited layer where vias between adjacent layers of metal circuitry are needed, PA1 curing the deposited layer at a temperature between about 300.degree. and about 400.degree. C. and PA1 forming another layer of metal circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.