Joseph Funari
28Patents
23h-index
30Co-inventors
85Inventor score
Filing activity: Dec 17, 1976 → Jan 8, 1998
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5203075A | Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders | Emerging Cross-Sectional Technologies | 245 | Expired |
| US5241454A | Mutlilayered flexible circuit package | Emerging Cross-Sectional Technologies | 179 | Expired |
| US5109318A | Pluggable electronic circuit package assembly with snap together heat sink housing | Electricity | 140 | Expired |
| US5261155A | Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders | Emerging Cross-Sectional Technologies | 121 | Expired |
| US5715144A | Multi-layer, multi-chip pyramid and circuit board structure | Electricity | 90 | Expired |
| US4849856A | Electronic package with improved heat sink | Electricity | 84 | Expired |
| US5907903A | Multi-layer-multi-chip pyramid and circuit board structure and method of forming same | Emerging Cross-Sectional Technologies | 79 | Expired |
| US5222649A | Apparatus for soldering a semiconductor device to a circuitized substrate | Electricity | 62 | Expired |
| US4171477A | Micro-surface welding | Electricity | 59 | Expired |
| US5435732A | Flexible circuit member | Emerging Cross-Sectional Technologies | 53 | Expired |
| US5744759A | Circuit boards that can accept a pluggable tab module that can be attached or removed without solder | Electricity | 52 | Expired |
| US5207372A | Method for soldering a semiconductor device to a circuitized substrate | Electricity | 52 | Expired |
| US5003429A | Electronic assembly with enhanced heat sinking | Electricity | 46 | Expired |
| US5553769A | Interconnection of a carrier substrate and a semiconductor device | Emerging Cross-Sectional Technologies | 43 | Expired |
| US4294729A | Composition containing alcohol and use thereof for epoxy removal | Electricity | 37 | Expired |
| US4392617A | Spray head apparatus | Performing Operations; Transporting | 34 | Expired |
| US5057969A | Thin film electronic device | Emerging Cross-Sectional Technologies | 32 | Expired |
| US5565119A | Method and apparatus for soldering with a multiple tip and associated optical fiber heating device | Electricity | 31 | Expired |
| US5859470A | Interconnection of a carrier substrate and a semiconductor device | Emerging Cross-Sectional Technologies | 31 | Expired |
| US5920125A | Interconnection of a carrier substrate and a semiconductor device | Emerging Cross-Sectional Technologies | 29 | Expired |
| US5321884A | Multilayered flexible circuit package | Emerging Cross-Sectional Technologies | 29 | Expired |
| US4434134A | Pinned ceramic substrate | Emerging Cross-Sectional Technologies | 27 | Expired |
| US4670325A | Structure containing a layer consisting of a polyimide and an organic filled and method for producing such a structure | Emerging Cross-Sectional Technologies | 26 | Expired |
| US5115964A | Method for bonding thin film electronic device | Emerging Cross-Sectional Technologies | 23 | Expired |
| US5028984A | Epoxy composition and use thereof | Electricity | 22 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.