Microconnector with high contact density
US4671593A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 1985 |
| Grant date | Jun 9, 1987 |
| Priority date | — |
| Expiry date | Jul 18, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/714
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A microconnector is used for connecting electrodes placed on a support and which are insulated from one another to the same number of conductors as there are electrodes and comprises a means for the elastic gripping of the support and flexible, elastic conductor wires, whose number is the same as that of the electrodes for connecting to the latter, which are insulated from one another and from the gripping means and which are fixed to the latter in such a way that each of them can come into contact with a single electrode when the support is gripped by the gripping means. Application is to low temperature electrical connections and to high density connections in a reduced space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.