Semiconductor packaging and method
US4672421A · kind A · utility
59Cited by
11References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 15, 1986 |
| Grant date | Jun 9, 1987 |
| Priority date | — |
| Expiry date | May 15, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A mounting means for a semiconductor integrated circuit, the mounting means comprising a semiconductor material having a mounting surface as one major surface thereof, a semiconductor integrated circuit mounted on the major surface of the semiconductor material, and means for electrically connecting the integrated circuit to the semiconductor material. The mounting means has a coefficient of thermal expansion similar to the semiconductor integrated circuit mounted thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.