Paul T. Lin
45Patents
33h-index
18Co-inventors
82Inventor score
Filing activity: May 12, 1975 → Jul 23, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5216278A | Semiconductor device having a pad array carrier package | Electricity | 625 | Expired |
| US5222014A | Three-dimensional multi-chip pad array carrier | Emerging Cross-Sectional Technologies | 602 | Expired |
| US5200362A | Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film | Emerging Cross-Sectional Technologies | 368 | Expired |
| US5157480A | Semiconductor device having dual electrical contact sites | Emerging Cross-Sectional Technologies | 343 | Expired |
| US5239198A | Overmolded semiconductor device having solder ball and edge lead connective structure | Emerging Cross-Sectional Technologies | 336 | Expired |
| US5273938A | Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer film | Emerging Cross-Sectional Technologies | 333 | Expired |
| US5258648A | Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery | Emerging Cross-Sectional Technologies | 296 | Expired |
| US5436203A | Shielded liquid encapsulated semiconductor device and method for making the same | Emerging Cross-Sectional Technologies | 262 | Expired |
| US5508556A | Leaded semiconductor device having accessible power supply pad terminals | Emerging Cross-Sectional Technologies | 250 | Expired |
| US5468999A | Liquid encapsulated ball grid array semiconductor device with fine pitch wire bonding | Electricity | 239 | Expired |
| US5450283A | Thermally enhanced semiconductor device having exposed backside and method for making the same | Electricity | 236 | Expired |
| US5045921A | Pad array carrier IC device using flexible tape | Emerging Cross-Sectional Technologies | 207 | Expired |
| US5247423A | Stacking three dimensional leadless multi-chip module and method for making the same | Electricity | 206 | Expired |
| US5012386A | High performance overmolded electronic package | Electricity | 145 | Expired |
| US5219117A | Method of transferring solder balls onto a semiconductor device | Electricity | 106 | Expired |
| US4791075A | Process for making a hermetic low cost pin grid array package | Emerging Cross-Sectional Technologies | 70 | Expired |
| US6093969A | Face-to-face (FTF) stacked assembly of substrate-on-bare-chip (SOBC) modules | Electricity | 67 | Expired |
| US5216283A | Semiconductor device having an insertable heat sink and method for mounting the same | Electricity | 65 | Expired |
| US4672421A | Semiconductor packaging and method | Electricity | 59 | Expired |
| US5006922A | Packaged semiconductor device having a low cost ceramic PGA package | Electricity | 57 | Expired |
| US5300187A | Method of removing contaminants | Emerging Cross-Sectional Technologies | 52 | Expired |
| US6369451B2 | Solder balls and columns with stratified underfills on substrate for flip chip joining | Emerging Cross-Sectional Technologies | 51 | Expired |
| US5280193A | Repairable semiconductor multi-package module having individualized package bodies on a PC board substrate | Electricity | 50 | Expired |
| US5018005A | Thin, molded, surface mount electronic device | Emerging Cross-Sectional Technologies | 49 | Expired |
| US6002178A | Multiple chip module configuration to simplify testing process and reuse of known-good chip-size package (CSP) | Electricity | 49 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.