Tin, lead, or tin-lead alloy plating bath
US4673470A · kind A · utility
7Cited by
4References
10Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 21, 1986 |
| Grant date | Jun 16, 1987 |
| Priority date | — |
| Expiry date | Feb 21, 2006 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/36
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A tin, lead, or tin-lead alloy plating bath comprising, as essential ingredients, an alkali metal salt, and a soluble divalent tin compound or/and a lead compound, all of an aliphatic or aromatic sulfocarboxylic acid of the general formula ##STR1## wherein R is a C.sub.1-4 hydrocarbon radical, M.sub.1 is a hydrogen atom or alkali metal atom, M.sub.2 is an alkali metal atom, and X.sub.1 and X.sub.2 are each a hydrogen atom, OH, COON, or SO.sub.3 N (where N represents a hydrogen atom or alkali metal atom).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.