Sputtering apparatus
US4673482A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 1986 |
| Grant date | Jun 16, 1987 |
| Priority date | — |
| Expiry date | Sep 25, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3402
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A sputtering apparatus for sputtering magnetic materials. The apparatus comprises at least one pair of magnetic field-generating sources, a substrate disposed within the magnetic field-generating sources, a target disposed opposite to the substrate, and a magnetic thin plate disposed at a side of the substrate which is remote from the target. The magnetic thin plate is disposed at a position in close contact with the substrate or a position slightly away from the substrate, or is disposed movably between such positions. When sputtering a magnetic material onto the substrate, a uniform magnetic field can be generated on the substrate surface by virtue of the provision of the thin magnetic plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.