Continuous sputtering apparatus
US4675096A · kind A · utility
42Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 1984 |
| Grant date | Jun 23, 1987 |
| Priority date | — |
| Expiry date | Aug 30, 2004 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/568
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A continuous sputtering apparatus comprising a main vacuum chamber, one loading station and a plurality of process stations capable of having their pressures controlled separately. The process station includes a sub vacuum chamber capable of being in communication with the main vacuum chamber through an opening and an evacuation port. The loading station and the process stations are arranged to be spaced with equal angles. Substrate holders are provided to face the stations and are rotated by said equal angle in a time. The substrate holder opens and closes the opening of the sub vacuum chamber to serve as a gate valve.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.