Circuit board
US4677252A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1986 |
| Grant date | Jun 30, 1987 |
| Priority date | — |
| Expiry date | Nov 18, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/302
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board comprises a rigid metal substrate, a conductive metal layer formed into a predetermined circuit pattern, and a resinous layer interposed between the metal substrate and the metal layer for electrically insulating and bonding the metal substrate and the metal layer, the conductive metal layer having an elongation at break of not less than 15%, and the resinous layer comprising a first resinous layer having a volume resistivity of not less than 10.sup.10 .OMEGA.. cm, and a second resinous layer having an elongation at break of not less than 100%. The circuit board has a desired dielectric strength between the metal substrate and the conductive metal layer and can be bent without resulting disconnection in the metal layer or the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.