Resin molding apparatus
US4678421A · kind A · utility
3Cited by
13References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 25, 1985 |
| Grant date | Jul 7, 1987 |
| Priority date | — |
| Expiry date | Nov 25, 2005 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2043/3615
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A resin molding apparatus which can produce a molded resin article having neither a runner nor a gate portion thereon. The resin molding apparatus comprises a pouring pot including a pot having a heating member provided therein, and a piston member disposed for up and down movement within the pot and having a lifted position in which the piston member defines part of a mold cavity. Since the appratus has no runner or gate portion therein, the necessity of a high injecting force to be applied to a metal mold and hence of a high mold clamping force can be eliminated and the overall size of the apparatus can be reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.