Improved method for double floating transport and processing of wafers
US4681776A · kind A · utility
17Cited by
2References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 28, 1986 |
| Grant date | Jul 21, 1987 |
| Priority date | — |
| Expiry date | Jan 28, 2006 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65G51/03
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
Method of transporting and processing of substrates. Particularly, transporting the substrate in a double floating mode within a confined passageway and selectively rotating the substrate within the passageway by applying pressurized fluid medium across the planar surface of the substrate. Processing of the substrate may be accomplished during the rotating by directing processing agents such as cleaning medium, rinsing medium, developing agent, etching agent, and the like, onto a surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.