Semiconductor device including leadless packages and a base plate for mounting the leadless packages
US4682207A · kind A · utility
60Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 3, 1986 |
| Grant date | Jul 21, 1987 |
| Priority date | — |
| Expiry date | Oct 3, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a plurality of leadless packages and a base plate for mounting the leadless packages. The leadless packages include a semiconductor chip housed therein and a plurality of electrodes formed on the surface thereof. The base plate has conductor patterns formed on both of two main surfaces thereof, and the electrodes of each leadless package are soldered to the conductor patterns. The base plate also has a plurality of lead pins which project from one edge thereof in parallel with the main surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.